EXPERT LINE PIANOSTYR low pressure, one component polyurethane adhesive with gun designed for bonding polystyrene boards in seamless thermal insulation systems as well as XPS and EPS boards
or thermal insulation of building foundations, ground-level part, cellars, etc.
Bonding polystyrene boards in seamless thermal insulation systems
PIANOSTYR Polyurethane Adhesive is designed for bonding polystyrene boards when insulating building’s exterior walls, polystyrene panels, wall panels, plaster/cardboard panels, fastening window sills and stairs and crack filling in thermal insulation. The polyurethane adhesive exhibits excellent adhesion to concrete, ceramic, wooden and PVC substrates and all kinds of polystyrene and plasters. Boards are ready for sanding and anchoring after 2 hours from bonding
Extruded (XPS) polystyrene bonding
PIANOSTYR polyurethane adhesive can be used in building foundation thermal insulation systems for bonding extruded (XPS) polystyrene boards and expanded EPS) polystyrene boards. The polyurethane adhesive exhibits excellent adhesion to concrete, ceramic, wooden and PVC substrates as well as all kinds of polystyrene and plasters and substrates with ituminous layer, building paper and asphalt insulation material. Initial curing time is 2 hours from bonding - the works connected with foundation protection can be continued. Full polyurethane joint curing time: after 24h.
easy and convenient to use;
facilitates quick insulation work time (initial curing after 2 hours, full curing after 24 hours) ;
very good adhesion to bituminous substrates (non-solvent bituminous materials, thermoweldable building paper) as well as all mineral substrates.
excellent adhesion to concrete, mineral and ceramic substrates as well as plasters and the like; application in a wide range of temperatures.
working temperature (substrate and air): from -5°C to +30 °C ;
can temperature: +20°C
corrections time: about 10 min. (at: +23°C / RH 50%);
anchoring time: about 2 h
yield: (XPS bonding) up to 12m2 surface, (jointless method bonding): up to 8 m2 surface (capacity is dependent on temperature and humidity).
